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TEMSCON 2017 June 7-9, 2017 Santa Clara, CA USA Organizing Committee Michael Condry, Chair and President-Elect of TEMS Felix Lustenberger, President TEMS Xiaohong (Iris) Quan, Program Chair, San Jose State University Rajiv Sabherwal, Program Co-Chair, University of Arkansas Robert Bierwolf, VP Conferences Industry Forum Co-Chairs Michael Andrews, Andrews & Associates Anna Revolinsky, Qorvo Tim Worboys,
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Sponsorship for TEMSCON The IEEE Technology and Engineering Management Society (TEMS) welcomes Industry Sponsors to engage in TEMSCON and other IEEE TEMS programs. The IEEE is a non-profit and highly welcomes industry to engage in its events and benefit from such engagement. Platinum Patron: $10,000 Logo on the COVER of the TEMSCON Proceedings and Final
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Registration The registration is done at EDAS with the link http://edas.info/r22503. The table below shows the fees, select the one suitable for you. First register for TEMSCON then any Extra Pages or Tickets Registration for the Industry Forum is available at:https://temscon-industry-forum-2017.eventbrite.com. Fees are available on eventbrite for this event. Category Price 1. Early IEEE Members
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TEMSCON 2017 Venue Information Hotels The convention hotel is the Santa Clara Hilton. The hotel web site is http://www.hilton.com/en/hi/groups/personalized/S/SJCSCHF-IEEE7-20170607/index.jhtml?WT.mc_id=POG .Convention hotel space, particularly for Wednesday June 7 is very limited. It may be necessary for you to say for some of the time at a different hotel. Across the street is Hyatt Regency Santa Clara
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TEMSCON 2017 Special Sessions Information Concept Special Sessions are an exceptional form of conference track organized by a group of individuals with similar topic interests and approved by conference and program chairs. The concept is a new topic not already addressed within the current call for papers tracks. To form a special session summarize a
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Instructions for Authors Committee members of TEMSCON2017 invite researchers and engineers of all technology and engineering management disciplines to submit their original manuscripts for regular tracks and Special Sessions. We welcome submissions from industries and across academic fields including but not limited to engineering, management, and entrepreneurship. For those experienced with the IEEE papers just
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2017 International Conference of the IEEE Technology and Engineering Management Society Download CFP Flyer TEMSCON 2017 Silicon Valley (Santa Clara), California USAJune 8-10, 2017 Innovation and technology management in the entrepreneurial era Moving Technical Idea to Market Chair: Michael Condry, President-Elect IEEE TEMS Program Chair: Xiaohong (Iris) Quan, San Jose State University Program Co-Chair: Rajiv
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INDUSTRY FORUM Friday, June 9, 2017 IEEE Technology and Engineering Management Society (IEEE TEMS) has a special interest in supporting the needs of industry. We’re pioneering the first IEEE TEMS Industry Forum in conjunction with TEMSCON to bring industry leaders together to discuss the challenges they face. Join us to learn from speakers from Silicon
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June 8-10, 2017 Santa Clara, CA USA Time Shasta Tahoe Trinity Thursday, June 8 08:30 am10:00 am Introduction and Keynote I 10:00 am10:30 am Coffee Break 10:30 am12:00 pm Entrepreneurship and its Ecosystem I (YanLi Zhang) Management of Innovation I (Joel West) Technology Management I (Tugrul Daim) 12:00 pm01:00 pm Lunch 01:00 pm02:30 pm Entrepreneurship
Welcome to IEEE TEMSCON 2017! The 1st Annual International Conference of the IEEE Technology and Engineering Management SocietyJune 8-10, 2017 Santa Clara Hilton 4949 Great America Pkwy Silicon Valley (Santa Clara), California USA Dear Participants of TEMSCON 2017, TEMSCON 2017 is the inaugural flagship conference of the IEEE Technology and Engineering Management Society (TEMS) and